Chemical Engineering :: All Aptitude Test ::

1. Which of the following has the highest heat capacity?
A. Water
B. air
C. soil
D. Water

2.Which of the following are the processes of transfer of heat?
A. Conduction
B. Convection
C. Radiation
D. Conduction

3.The process of transfer of heat in solids is called:
A. Convection
B. Radiation
C. Conduction
D. Convection

4.The temperature at which liquid changes into vapour is called:
A. Melting point
B. boiling point.
C. expansion point
D. Melting point

5.In Conduction process the molecules of the solid pass the heat from one to another,:
A. without themselves moving from their positions.
B. themselves move from one place to another
C. without themselves moving from one place to another.
D. without themselves moving from their positions.

6.The process of transfer of heat in liquids & gases is called:
A. Conduction
B. Radiation
C. Convection
D. Conduction

7.In convection, the molecules:
A. without themselves moving from their positions.
B. themselves move from one place to another
C. without themselves moving from one place to another.
D. without themselves moving from their positions.

8. What is the correct formula for the rate of heat transfer (q) through a plane wall of thickness l and surface are A, when temperature difference between two surfaces is ΔT ? The thermal conductivity
A. q = (k A ΔT) / l
B. q = k A l ΔT
C. q = (ΔT) / (k A l)
D. q = (k A ΔT) / l

9.Thermal conductivity of the same material varies with
A. the thickness of the material
B. the temperature of the material
C. both a. and b.
D. the thickness of the material

10.The surface temperatures of a plate with thickness of 0.06 m are 100°C and 40°C. The thermal conductivity (k) of wall is 350 W/mK. What is the rate of heat transfer through the plate in kW/m2?
A. 350000
B. 350
C. 35
D. 350000

11.How does the thermal conductivity of a material change with respect to change in temperature of the same material?
A. thermal conductivity of a material increases with increase in its temperature
B. thermal conductivity of a material decreases with increase in its temperature
C. thermal conductivity of a material remains same with change in its temperature
D. thermal conductivity of a material increases with increase in its temperature

12.What does a composite wall mean?
A. two walls of different materials are connected in series without any gap between them
B. three walls of different materials are connected in series without any gap between them
C. more than three walls of different materials are connected in series without any gap between them
D. two walls of different materials are connected in series without any gap between them

13. When a composite wall of three layers in series having thermal resistances R1, R2 and R3 respectively. The heat transfer takes place normal to the surface of the layers. How is the total thermal resi
A. 1 / (R1 + R2 + R3)
B. ( (1 / R1) + (1 / R2) + (1 / R3) )
C. (R1 + R2 + R3)
D. 1 / (R1 + R2 + R3)

14.Generally the external thermal resistance between the surface of the body and the environment is
A. less than the internal conduction resistance in the body
B. more than the internal conduction resistance in the body
C. same as the internal conduction resistance in the body
D. less than the internal conduction resistance in the body

15.Suppose that a hot metal ball is immersed in cold water, then temperature distribution in the body depends upon
A. thermal conductivity of the body
B. convective heat transfer from the body surface to water
C. both a. and b.
D. thermal conductivity of the body

16.Suppose that a hot metal ball is suddenly immersed in cold water. What is the condition for the ball to maintain it at a uniform temperature?
A. the conduction resistance in a ball should be very large compared to the convection resistance for heat transfer from surface of ball to water
B. the conduction resistance in a ball should be very small compared to the convection resistance for heat transfer from surface of ball to water
C. the conduction resistance in a ball should be equal to the convection resistance for heat transfer from surface of ball to water
D. the conduction resistance in a ball should be very large compared to the convection resistance for heat transfer from surface of ball to water

17. What is lumped heat capacity analysis?
A. the analysis of a system in which it is assumed to be at nonuniform temperature
B. the analysis of a system in which it is assumed to be at uniform temperature
C. the analysis of a system in which it is assumed to be at either uniform or nonuniform temperature
D. the analysis of a system in which it is assumed to be at nonuniform temperature

18. The Biot number or Biot modulus is given by
A. the ratio of external convection resistance to the internal conduction resistance
B. the ratio of internal conduction resistance to the external convection resistance
C. multiplying internal conduction resistance and external convection resistance
D. the ratio of external convection resistance to the internal conduction resistance

19. What is the correct formula for The Biot number?
A. hl/k
B. k/hl
C. l/hk
D. hl/k

20.What should be the Biot number to assume the body at uniform temperature?
A. the Biot number should be less than 0.1
B. the Biot number should be more than 0.1
C. the Biot number should be equal to 0.1
D. the Biot number should be less than 0.1

21.The cooling of a metal ball of volume V, in large quantity of fluid is analogous to
A. discharging of battery in an electric system
B. discharging of capacitor in an electric system
C. generation of heat in resistor in an electrical system
D. discharging of battery in an electric system

22. In convection heat transfer energy transfer takes place between
A. two solid surfaces connected physically
B. solid surface and fluid system in motion
C. both a. and b.
D. two solid surfaces connected physically

23.What is the correct formula for the rate of heat transfer (q) from a surface of body of the area A to the surrounding fluid, when surface of the body is at temperature Ts and the surrounding fluid is
A. q = k A (Ts – T∞)
B. q = h A (Ts – T∞)
C. q = (h/k) A (Ts – T∞)
D. q = k A (Ts – T∞)

24.The convection heat transfer coefficient depends upon
A. the thermal properties of fluid
B. geometry of the system
C. characteristics of the fluid flow
D. the thermal properties of fluid

25.In a process of heat transfer by convection from a body to the surrounding fluid, the convection heat transfer coefficient
A. remains constant over the entire surface of the body
B. does not remain constant over the entire surface of the body
C. Both (a) and (b)
D. remains constant over the entire surface of the body

26. Which two processes are unitedly responsible in the transfer of heat between solid surface and surrounding fluid?
A. conduction and convection
B. conduction and mass transfer
C. convection and mass transfer
D. conduction and convection

27.When the surface of a body is at higher temperature than the surrounding fluid, then the heat flows firstly from surface of the body to the adjacent layer of fluid by
A. convection
B. conduction
C. radiation
D. convection

28. The fluid flow in which the fluid particles in one layer do not mix with the fluid particles in the other layer is called as
A. laminar flow
B. turbulent flow
C. layer flow
D. laminar flow

29.According to the Fourier's law of heat conduction, the rate of heat transfer by conduction depends upon
A. area of cross section normal to the heat flow
B. temperature gradient
C. both a. and b.
D. area of cross section normal to the heat flow

30.What is the temperature gradient in the conduction heat transfer?
A. change in temperature per unit change in time
B. change in temperature per unit change in distance in the direction of heat flow
C. change in temperature per unit change in cross-sectional area normal to the direction of heat flow
D. change in temperature per unit change in time


Date to Date Current Affairs 2022

PakMCQs.net

Quick Links

GAT Subject



   Computer Science    English Mcqs    Agriculture    

Engineering



   Computer Science    Civil Engineering    

Technical



   Networking    Electronics    Database    

Past Papers



   Model Papers    FPSC Papers